The following are expert witnesses for electronic packaging technology matters. Our experts cover the technologies of: semiconductor packaging, electronic packaging, MEMS packaging with deposition and testifying experience.


#1001              Expert has been retained as expert witness in litigation regarding the failure of electrical and electronic devices and systems. He is a professor with a PhD in Electrical Engineering who has court testifying experience. 


  • Semiconductor Processing
  • Sputtering
  • Photolithography
  • Plasma Deposition
  • Mask Design
  • Chemical Vapor Deposition (CVD)
  • Metalorganic Chemical vapor Deposition (MOCVD)
  • Diamond Deposition
  • Plasma Etching
  • Electron Beam deposition
  • Oxidation, Diffusion, and Ion Implantation
  • Process Equipment Design and Construction
  • Thin Film processing
  • Thick Film processing
  • Packaging
  • Wire bonding
  • 3D ICs processing


 #1030              Broad operating experience in senior technical roles at Fairchild, Intel, ESL/TRW, GTE, and three startup companies spanning the semiconductor, printing, and defense industries.  He has authored and is owner of 21 issued patents. 


  • Semiconductors packaging
  • Electronic packaging
  • Electro-mechanical systems
  • Printing
  • Mobile systems


#1024              Professor in Mechanical Engineering with over 40 years of industry experience. This expert has authored 36 books, 48 book chapters, over 500 articles and has spoken at invited talks, lectures and key note presentations.  His expertise is in opto-electronics semiconductor package , microelectronic packaging design,  power supplies, fans, systems, electronic products and MEMS packaging.  Expert has written expert reports, deposed and testified at federal and ITC courts.


  • Opto-electronics
  • Semiconductor package
  • Microelectonic packaging design
  • Power supplies
  • Fans
  • Electronic products
  • MEMS packaging